US Patent No. 10,772,219

COPPER FOIL WITH CARRIER, COPPER FOIL WITH RESIN AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD


Patent No. 10,772,219
Issue Date September 08, 2020
Title Copper Foil With Carrier, Copper Foil With Resin And Method For Manufacturing Printed Wiring Board
Inventorship Yoshinori Matsuura, Ageo (JP)
Assignee

Claim of US Patent No. 10,772,219

1. A copper foil comprising:a carrier comprising at least one resin selected from polyethylene naphthalate resins, polyethersulfone resins, polyimide resins, and polyphenylene sulfide resins;
a silicon layer provided on the carrier;
a carbon layer provided on the silicon layer; and
a copper layer provided on the carbon layer, the copper layer having an arithmetic average roughness Ra of 1.0 to 50 nm measured according to JIS B 0601-2001.