1. A copper foil comprising:a carrier comprising at least one resin selected from polyethylene naphthalate resins, polyethersulfone resins, polyimide resins, and polyphenylene sulfide resins;
a silicon layer provided on the carrier;
a carbon layer provided on the silicon layer; and
a copper layer provided on the carbon layer, the copper layer having an arithmetic average roughness Ra of 1.0 to 50 nm measured according to JIS B 0601-2001.