US Patent No. 10,772,214

CIRCUIT BOARD MANUFACTURING METHOD


Patent No. 10,772,214
Issue Date September 08, 2020
Title Circuit Board Manufacturing Method
Inventorship Masafumi Momose, Anjo (JP)
Tetsuya Dewa, Kariya (JP)
Assignee TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota-shi, Aichi-ken (JP) DENSO CORPORAT...

Claim of US Patent No. 10,772,214

1. A manufacturing method for a circuit board, comprising:welding a terminal pin to a land, the terminal pin being inserted in a through-hole of the land, wherein:
the land is covered with a white layer; and
an irradiation angle of a laser beam for welding with respect to the circuit board is adjusted so that reflected light which is a light of the laser beam emitted to the terminal pin reflected by the terminal pin strikes the white layer on the land.