US Patent No. 10,772,213

ADHESIVE SUBSTRATE AND METHOD FOR SEPARATING AN OBJECT FROM AN ADHESIVE SUBSTRATE


Patent No. 10,772,213
Issue Date September 08, 2020
Title Adhesive Substrate And Method For Separating An Object From An Adhesive Substrate
Inventorship Yuji Irisawa, Saitama (JP)
Toshiaki Hatsumi, Saitama (JP)
Assignee Shin-Etsu Polymer Co., Ltd., Tokyo (JP)

Claim of US Patent No. 10,772,213

1. A method for physically separating an object from an adhesive substrate, wherein the object is attached to a heat-resistant elastomer layer of the adhesive substrate, comprising the steps of:1) anchoring an upper side of the object by attaching a fixing means; and
2) applying a downward force to a base substrate of the adhesive substrate, thereby causing the heat-resistant elastomer layer to bend, resulting in separation,
wherein the adhesive substrate is repeatedly used, and
the adhesive substrate returns to its original state after the object is separated from the adhesive substrate.