US Patent No. 10,772,207

FLEXIBLE SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME


Patent No. 10,772,207
Issue Date September 08, 2020
Title Flexible Semiconductor Package And Method For Fabricating The Same
Inventorship Kyeong Su Kim, Seoul (KR)
Shin Park, Suwon-si (KR)
Jae Jin Lee, Kumi-si (KR)
Assignee MagnaChip Semiconductor, Ltd., Cheongju-si (KR)

Claim of US Patent No. 10,772,207

1. A semiconductor package attached to a curved display panel, comprising:a semiconductor chip, having a top surface and a side surface, disposed on a curved flexible film, wherein the curved flexible film is disposed on the curved display panel;
a flexible cover layer attached to the top surface and the side surface of the semiconductor chip; and
an underfill material formed between the semiconductor chip and the curved flexible film, and overlapping a solder resist,
wherein the flexible cover layer is in direct contact with the underfill material, the solder resist, and the top and side surfaces of the semiconductor chip, and
wherein the top surface of the semiconductor chip on the curved flexible film remains flat.