US Patent No. 10,772,206

BOARD TO BOARD INTERCONNECT


Patent No. 10,772,206
Issue Date September 08, 2020
Title Board To Board Interconnect
Inventorship Chee Ling Wong, Sungai Ara (MY)
Wil Choon Song, Bayan Lepas (MY)
Khang Choong Yong, Puchong (MY)
Eng Huat Goh, Ayer Itam (MY)
Mohd Muhaiyiddin Bin Abdullah, Kepala Batas (MY)
Tin Poay Chuah, Bayan Baru (MY)
Assignee Intel Corporation, Santa Clara, CA (US)

Claim of US Patent No. 10,772,206

1. A system, comprising:a first printed circuit board (PCB) having a first recess along a first edge of the first PCB, wherein the first recess includes a first solder pad exposed on a first layer of the first PCB and a second solder pad exposed on a second layer of the first PCB; wherein the first solder pad and the second solder pad being vertically and horizontally displaced from one another;
a second PCB having a second recess along a second edge of the second PCB, wherein the second recess is complementary to the first recess, and the second recess includes a third solder pad exposed on a third layer of the second PCB, and a fourth solder pad exposed on a fourth layer of the second PCB; wherein the third solder pad and the fourth solder pad being vertically and horizontally displaced from one another; and
a removable clamp to couple together the first PCB to the second PCB;
wherein:
the first solder pad is electrically coupled to the third solder pad on the third layer of the second PCB by at least a metallized particle interconnect, with the first solder pad aligned with the third solder pad on the third layer of the second PCB;
the second solder pad is electrically coupled to the fourth solder pad on the fourth layer of the second PCB by at least a metallized particle interconnect, with the second solder pad aligned with the fourth solder pad on the fourth layer of the second PCB; and
a z-height of the first PCB, a z-height of the second PCB and a z-height of the first PCB and the second PCB when coupled together are substantially equal.