US Patent No. 10,772,205

CIRCUIT BOARD, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF


Patent No. 10,772,205
Issue Date September 08, 2020
Title Circuit Board, Semiconductor Device Including The Same, And Manufacturing Method Thereof
Inventorship Jiun-Yi Wu, Taoyuan (TW)
Chien-Hsun Lee, Hsin-chu County (TW)
Chen-Hua Yu, Hsinchu (TW)
Chung-Shi Liu, Hsinchu (TW)
Assignee Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)

Claim of US Patent No. 10,772,205

1. A structure, comprising:a core layer including:
a first core dielectric layer;
a second core dielectric layer disposed on the first core dielectric layer;
through vias crossing the first core dielectric layer and the second core dielectric layer; and
a patterned conductive plate disposed on the first core dielectric layer and electrically insulated from the through vias; and
a build-up stack disposed on the core layer, including interconnected conductive patterns electrically connected to the through vias,
wherein the second core dielectric layer further extends on a top surface of the patterned conductive plate, a bottom surface of the patterned conductive plate is coplanar with an interface of the first core dielectric layer and the second core dielectric layer, and the patterned conductive plate is electrically insulated from the build-up stack.