US Patent No. 10,772,199

LOW TRANSMISSION LOSS COPPER FOIL AND METHODS FOR MANUFACTURING THE COPPER FOIL


Patent No. 10,772,199
Issue Date September 08, 2020
Title Low Transmission Loss Copper Foil And Methods For Manufacturing The Copper Foil
Inventorship Chien-Ming Lai, Taipei (TW)
Yao-Sheng Lai, Taipei (TW)
Jui-Chang Chou, Taipei (TW)
Assignee CHANG CHUN PETROCHEMICAL CO., LTD., Taipei (TW)

Claim of US Patent No. 10,772,199

1. A surface-treated copper foil comprising:an electrodeposited copper foil including a drum side and a deposited side, and
a treatment layer disposed on the drum side providing a surface-treated side,
wherein the treatment layer comprises a nodule layer and wherein the surface-treated side exhibits a material volume (Vm) in the range of 0.10 to less than 1.90 ?m3/?m2.