US Patent No. 10,772,198

ORGANIC INSULATOR, METAL-CLAD LAMINATE AND WIRING BOARD


Patent No. 10,772,198
Issue Date September 08, 2020
Title Organic Insulator, Metal-clad Laminate And Wiring Board
Inventorship Tadashi Nagasawa, Kirishima (JP)
Satoshi Yoshiura, Kirishima (JP)
Chie Chikara, Kirishima (JP)
Assignee KYOCERA CORPORATION, Kyoto (JP)

Claim of US Patent No. 10,772,198

1. An organic insulator, comprising an organic resin phase as a main component,the organic resin phase comprising a weather-resistant stabilizer,
the organic resin phase comprising an inner region and a surface region formed in at least one surface of the inner region,the surface region having a higher content ratio of the weather-resistance stabilizer than the inner region,wherein the organic resin phase comprises a thermosetting resin,
and
wherein the thermosetting resin is a cured material of a resin composition comprising a cyclic olefin copolymer having a crosslinkable functional group in a molecule,
a monomer having at least two ethylenic unsaturated groups in a molecule,
and a peroxide having a benzene ring in a molecule.