US Patent No. 10,772,194

CIRCUIT BOARD, CIRCUIT ASSEMBLY, AND CIRCUIT BOARD MANUFACTURING METHOD


Patent No. 10,772,194
Issue Date September 08, 2020
Title Circuit Board, Circuit Assembly, And Circuit Board Manufacturing Method
Inventorship Tou Chin, Yokkaichi (JP)
Arinobu Nakamura, Yokkaichi (JP)
Assignee AUTONETWORKS TECHNOLOGIES, LTD., Mie (JP) SUMITOMO WIRING SYSTEMS, LTD., ...

Claim of US Patent No. 10,772,194

1. A circuit board for use with an electronic component, the circuit board comprising:a substrate that has an upper surface on which a circuit pattern is formed, and a lower surface to which a plurality of bus bars that are spaced apart are fixed;
a placement through hole that extends through the upper surface and the lower surface and faces a bus bar of the plurality of bus bars and in which the electronic component is placed; and
a terminal conductor foil that is provided on the lower surface of the substrate and which protrudes inward into the placement through hole, the terminal conductor foil being connected to the electronic component through the placement through hole.