US Patent No. 10,772,192


Patent No. 10,772,192
Issue Date September 08, 2020
Title Board-to-board Contactless Connectors And Methods For The Assembly Thereof
Inventorship Roger D. Isaac, San Jose, CA (US)
Mostafa Naguib Abdulla, Rancho Cordova, CA (US)
Assignee KEYSSA SYSTEMS, INC., Campbell, CA (US)

Claim of US Patent No. 10,772,192

1. A device comprising:a first circuit board comprising a first contactless communications unit (CCU) mounted to a first surface of the first circuit board;
a second circuit board comprising a second CCU mounted to a second surface of the second circuit board, wherein the second circuit board is positioned below the first circuit board such that the first and second surfaces face each other and that a contactless board-to-board connection is established via the first and second CCUs, wherein each of the first and second CCUs comprises:
a printed circuit board;
a silicon die having a first side and a second side, wherein the first side is mounted to the printed circuit board;
a dielectric layer disposed on the second side of the silicon die;
a transducer disposed on the dielectric layer directly above the second side of the silicon die;
a ground plane adjustment layer disposed on or within the dielectric layer, wherein the ground plane adjustment layer defines an effective ground plane for the transducer, and wherein the silicon die is an actual ground plane for the transducer and wherein the effective ground plane is different than the actual ground plane; and
a collimating structure operative as a lens; and
a conduit structure mounted to the first and second circuit boards, wherein the conduit structure comprises a EHF channel for directing contactless signals being communicated between the first and second CCUs.