US Patent No. 10,772,191

PRINTED CIRCUIT BOARD DESIGN FOR HIGH SPEED APPLICATION


Patent No. 10,772,191
Issue Date September 08, 2020
Title Printed Circuit Board Design For High Speed Application
Inventorship Nan-Jang Chen, Hsinchu (TW)
Assignee MediaTek Inc., Hsinchu (TW)

Claim of US Patent No. 10,772,191

1. A printed circuit board, comprising:a substrate having a top surface and a bottom surface;
a plurality of first non-ground nets and a ground net disposed within a specific region on the top surface of the substrate;
a second non-ground net and a split ground net disposed on the bottom surface of the substrate, wherein the second non-ground net is electrically connected to one of the plurality of first non-ground nets through a first via hole in the substrate, and wherein the second non-ground net is isolated from the split ground net by a gap;
an outermost insulating layer on the bottom surface of the substrate and covering the second non-ground net and the split ground net; and
a conductive layer disposed on the outermost insulating layer corresponding to the specific region of the substrate in which the plurality of first non-ground nets and the ground net are arranged, such that the conductive layer overlaps with the plurality of first non-ground nets.