US Patent No. 10,772,190

HEAT-REMOVAL ASSEMBLIES WITH OPPOSING SPRINGS


Patent No. 10,772,190
Issue Date September 08, 2020
Title Heat-removal Assemblies With Opposing Springs
Inventorship Kristopher P. Laurent, Campbell, CA (US)
Brett W. Degner, Menlo Park, CA (US)
Assignee APPLE INC., Cupertino, CA (US)

Claim of US Patent No. 10,772,190

1. An electronic device comprising:a circuit board comprising a first circuit board surface and a second circuit board surface opposite the first circuit board surface;
a heat-generating assembly positioned on the first circuit board surface; and
a heat-removal assembly comprising:
a heat-dissipating subassembly; and
a fastener subassembly comprising:
a first spring comprising a first anchor portion and a first contact portion;
a second spring comprising a second anchor portion and a second contact portion; and
a coupling mechanism that couples the first anchor portion to the second anchor portion via a circuit board through-hole extending through the circuit board between the first circuit board surface and the second circuit board surface, wherein:
the first contact portion exerts a first contact force for forcing a portion of the heat-dissipating subassembly towards a portion of the heat-generating assembly;
the second contact portion exerts a second contact force for forcing a portion of the circuit board towards the heat-dissipating subassembly; and
the second spring exerts a force that is offset from all forces exerted by the first spring.