US Patent No. 10,772,188

STIFFENER COOLING STRUCTURE


Patent No. 10,772,188
Issue Date September 08, 2020
Title Stiffener Cooling Structure
Inventorship Ryan Elsasser, Poughkeepsie, NY (US)
David Charles Olson, Lagrangeville, NY (US)
Brian Werneke, Pleasant Valley, NY (US)
Assignee International Business Machines Corporation, Armonk, NY (US)

Claim of US Patent No. 10,772,188

1. An apparatus for providing a stiffening cooling structure for a printed circuit board, the apparatus comprising:the printed circuit board disposed on a top surface of the stiffening cooling structure, wherein a lower surface of the printed circuit board is opposite the top surface of the stiffening cooling structure;
one or more channels of the stiffening cooling structure defined by the top surface of the stiffening cooling structure, a bottom surface of the stiffening cooling structure, and one or more support members, wherein the one or more support members are positioned between the top surface of the stiffening cooling structure and the bottom surface of the stiffening cooling;
one or more apertures in the top surface of the stiffening cooling structure to direct airflow from the one or more channels of the stiffening cooling structure to one or more components disposed on a top surface of the printed circuit board; and
one or more apertures in the printed circuit board direct the airflow from the one or more apertures in the top surface of the stiffening cooling structure to the one or more components disposed on a top surface of the printed circuit board.