US Patent No. 10,772,187


Patent No. 10,772,187
Issue Date September 08, 2020
Title Electronic Equipment And Electronic Device
Inventorship Tomoyuki Mitsui, Tokyo (JP)
Assignee NEC CORPORATION, Minato-ku, Tokyo (JP)

Claim of US Patent No. 10,772,187

1. Electronic equipment comprising:a circuit board on which a heating element is mounted;
a first housing mounted on a first main surface of the circuit board in such a way that the heating element and a coolant are sealed with respect to the first main surface;
a deformation suppressing portion which suppresses deformation of the circuit board; and
a second housing mounted on a second main surface of the circuit board, the second main surface being on a side opposite to the first main surface in such a way that at least an area associated with a mounting area of the heating element is included on the second main surface, and the coolant is sealed with respect to the first housing via the circuit board, wherein
the deformation suppressing portion is a connection portion which connects a first space formed between the first main surface and the first housing, and a second space formed between the second main surface and the second housing in such a way that the coolant is allowed to flow between the first space and the second space.