US Patent No. 10,772,186


Patent No. 10,772,186
Issue Date September 08, 2020
Title Printed Circuit Board Component Cover
Inventorship Adolfo Gomez, Fort Collins, CO (US)
Tom J. Searby, Eaton, CO (US)
Andrew L. Wiltzius, Fort Collins, CO (US)
Assignee Hewlett-Packard Development Company, L.P., Spring, TX (US)

Claim of US Patent No. 10,772,186

16. A system for protecting components on a printed circuit board (PCB) comprising:a polycarbonate sheet, the polycarbonate sheet being formed to match a gross contour of a number of components coupled to the PCB; and
wherein the polycarbonate sheet attaches via interference fit at a slope relative to the PCB; and
wherein the polycarbonate sheet further comprises:
a field of perforations to facilitate cooling of components on the PCB, the perforations arranged in a regular pattern over a surface of the polycarbonate sheet;
a number of apertures through each of which a respective component on the PCB extends when the polycarbonate sheet is in place as a cover on the PCB.