US Patent No. 10,716,250

COMPONENT MOUNTING APPARATUS


Patent No. 10,716,250
Issue Date July 14, 2020
Title Component Mounting Apparatus
Inventorship Takeshi Fujishiro, Toyohashi (JP)
Koji Kawaguchi, Kasugai (JP)
Mitsuru Sanji, Toyota (JP)
Kohei Sugihara, Nishio (JP)
Assignee FUJI CORPORATION, Chiryu-shi (JP)

Claim of US Patent No. 10,716,250

1. A component mounting apparatus comprising:a mounting head, including
a nozzle holder that extends in an up-down direction, the nozzle holder including a pin that is bridged to the lower end of the nozzle holder in a diametrical direction of the nozzle holder,
a nozzle that is attached to a lower end of the nozzle holder to be movable up and down with respect to the nozzle holder,
an elastic body that elastically supports the nozzle,
a protrusion that is provided at a position that is offset from the central axis of the nozzle, and
a nozzle lifting and lowering mechanism that is able to move the nozzle downward by engaging with the protrusion and pressing down the protrusion against elastic force of the elastic body; and
a control device that controls the mounting head, the control device configured to
measure in advance a deviation amount between a tip position of the nozzle before the nozzle lifting and lowering mechanism moves the nozzle downward and a tip position of the nozzle after the nozzle lifting and lowering mechanism moves the nozzle downward when the nozzle lifting and lowering mechanism presses down a predetermined reference position of the protrusion,
set a position on the protrusion on a line corresponding to a line along which the pin extends as the reference position, and
control the mounting head so as to suck a component to mount the component on a board taking the deviation amount into account.