US Patent No. 10,716,219

ELECTRONIC PRODUCT AND MANUFACTURING METHOD THEREOF


Patent No. 10,716,219
Issue Date July 14, 2020
Title Electronic Product And Manufacturing Method Thereof
Inventorship Yi-Feng Pu, Taipei (TW)
Tzu-Shu Lin, Taipei (TW)
Pei-Hsuan Huang, Taipei (TW)
Assignee LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Guangzhou (CN) LITE-ON TECHNOLOGY...

Claim of US Patent No. 10,716,219

1. A manufacturing method of an electronic product, comprising:forming a conductive circuit on a film by a hot stamping process, wherein the conductive circuit is made by a metal foil, a part of the metal foil is pressed and fixed to the film so as to pattern the metal foil as a conductive metal layer to form the conductive circuit, wherein a heat resistant releasing layer is disposed on the conductive metal layer and separates the conductive metal layer and a press plate, and a part of the metal foil not pressed and fixed to the film is removed by peeling off the heat resistant releasing layer;
disposing an electronic element on the conductive circuit of the film, wherein the electronic element is electrically connected to the conductive circuit; and
combining the film and a supporting structure by an out-mold molding technology or an in-mold molding technology, such that the electronic element is wrapped between the film and the supporting structure.