US Patent No. 10,716,217


Patent No. 10,716,217
Issue Date July 14, 2020
Title Poly-based Burr Suppressor
Inventorship Shane Hugh Stewart, Belfountain (CA)
Assignee Advanced Copper Foil Inc., Mississauga, ON (CA)

Claim of US Patent No. 10,716,217

1. A method for manufacturing a printed circuit board (PCB), the method comprising:constructing a book having a burr-suppressing copper foil on at least one exterior side of the book, the burr-suppressing copper foil comprising a poly-based film having an adhesive applied at opposing sides, a copper foil directly contacting and coupled to the poly-based film with the adhesive on a first side of the poly-based film, the copper foil adjacent to and in contact with a pre-impregnated layer, and a metallic burr suppressor coupled to the poly-based film with the adhesive on a second side of the poly-based film, the metallic burr suppressor being an outer layer of the book;
applying a lamination cycle to the book using a laminating press to cure the pre-impregnated layer of the book and form a laminated book;
after the lamination cycle, drilling the laminated book; and
removing the poly-based film and the metallic burr suppressor from the drilled and laminated book.