US Patent No. 10,716,213

DIRECT CONNECTION OF HIGH SPEED SIGNALS ON PCB CHIP


Patent No. 10,716,213
Issue Date July 14, 2020
Title Direct Connection Of High Speed Signals On Pcb Chip
Inventorship Hyunjun Kim, Mercer Island, WA (US)
Andy Becker, Eau Claire, WI (US)
Jim Fitzke, Eau Claire, WI (US)
Brad Smith, Chippewa Falls, WI (US)
Paul Wildes, Eau Claire, WI (US)
Assignee Hewlett Packard Enterprise Development LP, Houston, TX (US)

Claim of US Patent No. 10,716,213

1. A circuit board assembly capable of transferring a select grouping of high-speed signals from an electronic chip to a second system, the assembly comprising:a circuit board configured the support an electronic chip on a first surface thereof and to provide a plurality of electrical communication paths capable of carrying the select grouping of high-speed signals to and from the chip, the communication paths comprising at least one via extending through the circuit board and positioned below the chip capable of carrying at least one signal to a second side of the circuit board;
a paddle card positioned adjacent the second side of the circuit board and opposite the electronic chip, the paddle card having electrical connections to receive the select grouping of signals so that the select grouping of signals can be transmitted through the paddle card; and
a high-speed cable electrically coupled to the paddle card configured to carry the select grouping of high-speed signals to the second system; and
an interposer attached to the circuit board on the second surface of the circuit board at a location opposite the chip, and between the board and the paddle card, the interposer capable of allowing the select grouping of signals to be received and be present to the electrical connections on the paddle card.