US Patent No. 10,716,210

PRINTED CIRCUIT BOARD INCLUDING THROUGH-HOLE VIAS


Patent No. 10,716,210
Issue Date July 14, 2020
Title Printed Circuit Board Including Through-hole Vias
Inventorship Christopher M Barnette, Plano, TX (US)
William K Fitzgerald, Plano, TX (US)
Michael Day, Plano, TX (US)
Assignee Hewlett Packard Enterprise Development LP, Houston, TX (US)

Claim of US Patent No. 10,716,210

1. An electronic system, comprising: a printed circuit board having a plurality of internal layers disposed between a first surface and a second surface; a plurality of card-edge connectors disposed on the first surface; and a semiconductor chip disposed on the first surface, wherein the printed circuit board includes: a first through-hole via conductively coupled to the semiconductor chip; a second through-hole via conductively coupled to a first card-edge connector of the plurality of card-edge connectors; a first route that conductively couples the first through-hole via to the second through-hole via on a first internal layer of the plurality of internal layers; a first microvia via conductively coupled to a second card-edge connector of the plurality of card-edge connectors; and a second route that conductively couples the second through-hole via to the first microvia on a second internal layer of the plurality of internal layers; wherein: the first microvia extends through one or more of the internal layers without extending to both the first surface and the second surface; and the first through-hole via and the second through-hole via extend through the printed circuit board to both the first surface and the second surface; wherein the printed circuit board includes: a third through-hole via conductively coupled to the semiconductor chip; a fourth through-hole via conductively coupled to the first card-edge connector: a third route that conductively couples the third through-hole via to the fourth through-hole via on the first internal layer; a first sequential lamination via conductively coupled to the second card-edge connector; and a fourth route that conductively couples the fourth through-hole via to the first sequential lamination via on a third internal layer of the plurality of internal layers; wherein: the third through-hole via and the fourth through-hole via extend through the printed circuit board to both the first surface and the second surface; and the sequential lamination via extends through one or more of the internal layers without extending to both the first surface and the second surface.