US Patent No. 10,716,209

FIBER WEAVE-SANDWICHED DIFFERENTIAL PAIR ROUTING TECHNIQUE


Patent No. 10,716,209
Issue Date July 14, 2020
Title Fiber Weave-sandwiched Differential Pair Routing Technique
Inventorship Bok Eng Cheah, Bukit Gambir (MY)
Eng Huat Goh, Penang (MY)
Jackson Chung Peng Kong, Tanjung Tokong (MY)
Khang Choong Yong, Puchong (MY)
Min Suet Lim, Simpang Ampat (MY)
Assignee Intel Corporation, Santa Clara, CA (US)

Claim of US Patent No. 10,716,209

1. A printed circuit board, comprising:a central dielectric layer including at least one fiber that provides mechanical strength for the printed circuit board;
a top dielectric layer disposed above the central dielectric layer;
a top electrical trace layer positioned between the central dielectric layer and the top dielectric layer, top electrical trace layer being patterned to form a top electrical trace having longitudinal ends that electrically connect through the top dielectric layer by electrically conductive vias; and
a bottom electrical trace layer positioned below the central dielectric layer, the bottom electrical trace layer being patterned to form a bottom electrical trace having longitudinal ends that each electrically connect through the central and top dielectric layers by electrically conductive vias, at least a portion of the bottom electrical trace being parallel to and directly below at least a portion of the top electrical trace.