US Patent No. 10,716,208

WIRING BOARD


Patent No. 10,716,208
Issue Date July 14, 2020
Title Wiring Board
Inventorship Shuhei Momose, Nagano (JP)
Assignee SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-Shi (JP)

Claim of US Patent No. 10,716,208

1. A wiring board comprising:a first insulating layer;
a second insulating layer that is formed on an upper face of the first insulating layer;
a first metal layer that is formed on an upper face of the second insulating layer;
a third insulating layer that is formed on the upper face of the second insulating layer so as to cover the first metal layer;
an opening portion that penetrates at least the second insulating layer, the first metal layer and the third insulating layer in a thickness direction of the wiring board;
an electronic component that is provided in the opening portion;
a filling insulating layer that fills the opening portion and covers the electronic component; and
a wiring layer that is formed on an upper face of the filling insulating layer,
wherein a first step portion is formed by a side face of the second insulating layer constituting an inner side face of the opening portion and a side face of the first metal layer constituting the inner side face of the opening portion.