US Patent No. 10,716,207

PRINTED CIRCUIT BOARD AND INTEGRATED CIRCUIT PACKAGE


Patent No. 10,716,207
Issue Date July 14, 2020
Title Printed Circuit Board And Integrated Circuit Package
Inventorship Yongming Xiong, Fremont, CA (US)
Assignee Innovium, Inc., San Jose, CA (US)

Claim of US Patent No. 10,716,207

1. An apparatus comprising:a printed circuit board that includes:
a multilayer lamination of layers that includes one or more ground layers, one or more power layers, and a plurality of signal layers;
a plurality of vias that are formed through the multilayer lamination of layers; and
a plurality of bonding pads that provide coupling for a ball grid array of an integrated circuit (IC) package to the one or more ground layers, the one or more power layers, and the plurality of signal layers through the plurality of vias,
wherein the multilayer lamination of layers includes:
one or more first signal layers of the plurality of signal layers for transferring a first type of signal; and
one or more second signal layers of the plurality of signal layers for transferring a second type of signal,
wherein the one or more first signal layers are arranged in a first section of the multilayer lamination of layers and the one or more second signal layers being arranged in a different second section of the multilayer lamination of layers,
wherein the one or more first signal layers in the first section are separated from the one or more second signal layers in the second section by at least one ground layer of the one or more ground layers,
wherein the first section is closer to a surface of the printed circuit board that includes the plurality of bonding pads, and
wherein the one or more second signal layers transfer signals closer to a central area of the printed circuit board compared to the one or more first signal layers, the central area corresponding to an area of the printed circuit board that couples the ball grid array of the integrated circuit (IC) package.