US Patent No. 10,716,201

COMPONENT CARRIER AND METHOD TO PRODUCE SAID COMPONENT CARRIER


Patent No. 10,716,201
Issue Date July 14, 2020
Title Component Carrier And Method To Produce Said Component Carrier
Inventorship Hyung Wook Park, Trofaiach (AT)
Assignee

Claim of US Patent No. 10,716,201

1. A component carrier formed of a printed circuit board, an intermediate printed circuit board product, or an IC-substrate disposed in an electronic device wherein the electronic device comprises a casing on the outside of the component carrier wherein the casing further comprises a first component and a second component; and wherein the component carrier is a multi-layer component carrier that further comprises at least one heat-releasing component that is embedded within at least one carrier layer of the component carrier such that the at least one heat-releasing component does not extend through the component carrier, and wherein the at least one embedded heat-releasing component is thermoconductively coupled to a heat spreader layer, wherein the heat spreader layer is one carrier layer of the multi-layer component carrier and forms the second component of the casing of said electronic device.