US Patent No. 10,694,644

THERMOELECTRIC-ENHANCED, INLET AIR-COOLED THERMAL CONDUCTORS


Patent No. 10,694,644
Issue Date June 23, 2020
Title Thermoelectric-enhanced, Inlet Air-cooled Thermal Conductors
Inventorship Levi A. Campbell, Poughkeepsie, NY (US)
Michael J. Ellsworth, Jr., Lagrangeville, NY (US)
Milnes P. David, Poughkeepsie, NY (US)
Dustin W. Demetriou, New York, NY (US)
Roger R. Schmidt, Poughkeepsie, NY (US)
Robert E. Simons, Poughkeepsie, NY (US)
Assignee INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)

Claim of US Patent No. 10,694,644

1. A cooling apparatus comprising:a thermal conductor to facilitate cooling a heat-dissipating component(s) within an enclosure, the enclosure comprising an air inlet side through which an airflow ingresses into the enclosure, the thermal conductor comprising:
a first conductor portion to couple to the heat-dissipating component(s) to conduct heat therefrom; and
a second conductor portion to position at the air inlet side of the enclosure, wherein when operational, the first conductor portion transfers heat, at least in part, from the heat-dissipating component(s) to the second conductor portion;
at least one air-cooled heat sink coupled to the second conductor portion of the thermal conductor to facilitate transfer of heat from the second conductor portion to the airflow ingressing into the enclosure through the air inlet side;
at least one thermoelectric device coupled to at least one of the first conductor portion or the second conductor portion of the thermal conductor to selectively provide active auxiliary cooling to the thermal conductor; and
a controller controlling operation of the at least one thermoelectric device and selectively switching operation of the cooling apparatus between an active cooling mode, where the at least one thermoelectric device is active, and a passive cooling mode, where the at least one thermoelectric device is inactive.