US Patent No. 10,694,641

WICKLESS CAPILLARY DRIVEN CONSTRAINED VAPOR BUBBLE HEAT PIPES FOR APPLICATION IN ELECTRONIC DEVICES WITH VARIOUS SYSTEM PLATFORMS


Patent No. 10,694,641
Issue Date June 23, 2020
Title Wickless Capillary Driven Constrained Vapor Bubble Heat Pipes For Application In Electronic Devices With Various System Platforms
Inventorship Sumita Basu, Portland, OR (US)
Shantanu D. Kulkarni, Hillsboro, OR (US)
Prosenjit Ghosh, Portland, OR (US)
Konstantin I. Kouliachev, Olympia, WA (US)
Assignee Intel Corporation, Santa Clara, CA (US)

Claim of US Patent No. 10,694,641

14. A system comprising:an electronic device embedded in a substrate; and
a wickless capillary driven constrained vapor bubble heat pipe embedded in the substrate, the wickless capillary driven constrained vapor bubble heat pipe including:
a capillary including:
a first curved wall,
a first linear wall directly coupled to the first curved wall,
a second curved wall,
a second linear wall directly coupled to the second curved wall,
a first corner formed by two first intersecting walls, a first of the two first intersecting walls of the first corner connected to the first linear wall and a second of the two first intersecting walls of the first corner connected to the second linear wall,
a third linear wall directly coupled to the second curved wall,
a third curved wall,
a fourth linear wall directly coupled to the third curved wall, and
a second corner formed by two second intersecting walls, a first of the two second intersecting walls of the second corner connected to the third linear wall and a second of the two second intersecting walls of the second corner connected to the fourth linear wall; and
a liquid partially filling the capillary to dissipate heat.