US Patent No. 10,694,637

MODULAR ANTENNA ARRAY SYSTEM WITH THERMAL MANAGEMENT


Patent No. 10,694,637
Issue Date June 23, 2020
Title Modular Antenna Array System With Thermal Management
Inventorship Jeremiah D. Wolf, Atkins, IA (US)
Scott J. Sellner, Lisbon, IA (US)
James B. West, Cedar Rapids, IA (US)
Eric D. Baldwin, Amana, IA (US)
Assignee Rockwell Collins, Inc., Cedar Rapids, IA (US)

Claim of US Patent No. 10,694,637

1. An antenna assembly comprising:a plurality of RF card assemblies, each of the RF card assemblies comprising an RF circuit board having a number of antenna elements;
a backplane circuit board having a top surface with at least one set of power supply rails, wherein each set of power supply rails includes an electric power rail and a ground path rail, wherein the electric power rail comprises a plurality of first connections configured to supply electric power to the RF card assemblies and the ground path rail comprises a plurality of second connections configured to provide a ground path to the RF card assemblies;
a plurality of connectors arranged in rows along the top surface of the backplane circuit board, each of the connectors having a bottom surface configured to engage the top surface of the backplane circuit board, each of the connectors having an inlet configured to receive one of the RF card assemblies along a plane perpendicular to the top surface of the backplane circuit board, wherein the bottom surface includes a plurality of power supply pins configured to engage the electric power rail and the ground path rail; and
a chassis configured to enclose the backplane circuit board, the RF card assemblies, and the connectors;
wherein the RF card assemblies are each spaced a distance apart, wherein the distance is a value corresponding to at least a half wavelength of a highest operating frequency of the antenna assembly.