1. A method of encapsulating a printed circuit board of a motor controller with a potting material, said method comprising:inserting the printed circuit board into a recess formed in a base portion of an encapsulation assembly such that a bottom surface of the printed circuit board is spaced from a surface of the recess;
coupling a cover portion of the encapsulation assembly to the base portion to define a cavity therebetween;
injecting the potting material into the cavity through at least one injection port defined in at least one of the base portion and the cover portion such that the printed circuit board is at least partially coated in the potting material; and
coupling a plurality of isolation structures to at least one of said base portion and said cover portion, wherein the plurality of isolation structures prevent the potting material from contacting a plurality of predetermined portions of the printed circuit board.