US Patent No. 10,694,617

PLASTIC INJECTION MOLDED POTTING CUPS AND RELATED METHODS


Patent No. 10,694,617
Issue Date June 23, 2020
Title Plastic Injection Molded Potting Cups And Related Methods
Inventorship Michael David Brazeau, Raleigh, NC (US)
Benjamin John Sokol, Carrboro, NC (US)
Assignee Sensus Spectrum, LLC, Morrisville, NC (US)

Claim of US Patent No. 10,694,617

1. A potting cup positioned on a printed circuit board, the potting cup encapsulating only a portion of the printed circuit board including at least one interface subject to corrosion when exposed to moisture and configured to receive a potting material in the encapsulated portion to cover the at least one interface subject to corrosion, wherein the potting cup comprises a slot such that a portion of the potting cup is positioned directly over an upper surface of the printed circuit board and a portion of the potting cup is positioned directly below a lower surface of the printed circuit board.