1. A mounting device for arranging components on a board, the mounting device comprising:a mounting head including a raising and lowering member to which a pickup member configured to pick up a component is attached;
a head moving section configured to horizontally move the mounting head;
a first raising and lowering drive section configured to vertically raise and lower the raising and lowering member;
a second raising and lowering drive section configured to vertically raise and lower the pickup member with respect to the raising and lowering member;
a transfer device including a transfer stage, the transfer device being configured to form a transfer film of a transfer material on the transfer stage;
a height measurement device including a detecting section which detects a load applied to the pickup member, the height measurement device being configured to measure at least one of a stage height of the transfer stage or a component thickness of the component by acquiring a height of the pickup member when the load applied to the pickup member is detected by the detecting section; and
a control section configured to control raising and lowering operation of at least the first raising and lowering drive section when transferring the transfer film to the component, the control of the raising and lowering operation by the control section is based on height information that includes at least one of information of the component thickness measured by the height measurement device or information of the stage height measured by the height measurement device.