US Patent No. 10,660,236

SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MANAGEMENT


Patent No. 10,660,236
Issue Date May 19, 2020
Title Systems And Methods For Using Additive Manufacturing For Thermal Management
Inventorship Brian Magann Rush, Niskayuna, NY (US)
William Dwight Gerstler, Niskayuna, NY (US)
Stefano Angelo Mario Lassini, Lowell, MI (US)
Todd Garrett Wetzel, Niskayuna, NY (US)
Assignee GENERAL ELECTRIC COMPANY, Schenectady, NY (US)

Claim of US Patent No. 10,660,236

1. A thermal management system for electronics including a circuit card having electronic heat generating components provided on the circuit card, the thermal management system comprising:an integrally formed vapor chamber configured to contain a working fluid that conducts heat from the electronic heat generating components, the integrally formed vapor chamber comprising a heatframe and at least one receptacle on a side of the heat frame in fluid communication with the heat frame, wherein the heatframe comprises a card mounting portion adjacent the at least one receptacle to retain the circuit card so that the electronic heat generating components are conductively coupled to the heatframe when the circuit card having the electronic heat generating components is retained in the card mounting portion, wherein the heatframe further comprises a wick structure in the card mounting portion that directs the working fluid from the at least one receptacle towards the electronic heat generating components,
wherein the integrally formed vapor chamber comprises integrally formed internal support posts that extend between opposing sides of the integrally formed vapor chamber, wherein the integrally formed internal support posts comprise wick structures, and wherein pores of the wick structures of the integrally formed internal support posts that are adjacent the opposing sides of the integrally formed vapor chamber are larger than pores that are in the middle of the opposing sides, and the larger pores transport the working fluid to the heatframe and the smaller pores transport vapor to the at least one receptacle.