US Patent No. 10,660,227

ELECTRONIC MODULE AND METHOD OF MANUFACTURING ELECTRONIC MODULE


Patent No. 10,660,227
Issue Date May 19, 2020
Title Electronic Module And Method Of Manufacturing Electronic Module
Inventorship Issei Yamamoto, Kyoto (JP)
Assignee MURATA MANUFACTURING CO., LTD., Kyoto (JP)

Claim of US Patent No. 10,660,227

1. An electronic module comprising:a substrate that has a first main surface and a second main surface;
at least one first electronic component that is mounted on the first main surface;
at least one second electronic component that is mounted on the second main surface;
a first sealing resin portion that is provided on the first main surface so as to cover the first electronic component; and
a second sealing resin portion that is provided on the second main surface so as to cover the second electronic component,
wherein at least one through hole is provided so as to extend through the substrate and the first sealing resin portion,
wherein a third electronic component is located in the through hole,
wherein an area between an inner wall of the through hole and the third electronic component is filled with the second sealing resin portion, and the second sealing resin portion is provided so as to be exposed at a surface of the first sealing resin portion,
wherein, when viewed in a direction perpendicular to the first main surface, the second sealing resin portion surrounds the third electronic component, and
wherein the first sealing resin portion and the second sealing resin portion are made of different types of resins.