US Patent No. 10,660,219

RESIN MULTILAYER SUBSTRATE


Patent No. 10,660,219
Issue Date May 19, 2020
Title Resin Multilayer Substrate
Inventorship Yoshihito Otsubo, Nagaokakyo (JP)
Asato Fujimoto, Nagaokakyo (JP)
Assignee MURATA MANUFACTURING CO., LTD., Kyoto (JP)

Claim of US Patent No. 10,660,219

1. A resin multilayer substrate comprising:a stacked body including a plurality of resin layers each made of a thermoplastic resin as a main material and stacked on each other;
a cavity provided in the stacked body so as to be recessed in a stacking direction of the stacked body;
one or more first conductor patterns each disposed in a gap between the plurality of resin layers inside the stacked body and each including an outline in a view seen in one direction of the stacking direction of the stacked body; and
one or more second conductor patterns each disposed in a gap between the plurality of resin layers inside the stacked body and each including an outline in the view seen in the one direction of the stacking direction of the stacked body; wherein
at least a portion of the outline of each of the one or more first conductor patterns overlaps with the cavity in the view seen in the one direction of the stacking direction of the stacked body;
the outline of each of the one or more second conductor patterns does not overlap with the cavity in the view seen in the one direction of the stacking direction of the stacked body;
a resin portion is provided adjacent to an outside of each of the one or more first conductor patterns along a portion of the outline of each of the one or more first conductor patterns that overlaps with the cavity;
the resin portion is made of a resin paste including thermoplastic resin powder as a main material;
a liquid component of the resin paste is not substantially present in the resin portion; and
the resin portion is not disposed in a portion along the outline of each of the one or more second conductor patterns.