US Patent No. 10,660,218

METHOD OF MANUFACTURING MULTILAYER CIRCUIT BOARD


Patent No. 10,660,218
Issue Date May 19, 2020
Title Method Of Manufacturing Multilayer Circuit Board
Inventorship Xian-Qin Hu, Qinhuangdao (CN)
Li-Kun Liu, Qinhuangdao (CN)
Yan-Lu Li, Qinhuangdao (CN)
Ming-Jaan Ho, Tu-Cheng (TW)
Assignee HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Qinhuangdao (CN...

Claim of US Patent No. 10,660,218

1. A method of manufacturing a plurality of multilayer circuit boards comprising the steps of:providing an inner circuit board, the inner circuit board having at least one solder portion; forming a first protection layer on the at least one solder portion;
forming a first covering layer on the first protection layer;
covering the inner circuit board with an insulation adhesive;
vertically cutting the inner circuit board into a plurality of inner circuit units;
providing at least one outer substrate and pasting at least two of the plurality of inner circuit units with at the least one outer substrate by the insulation adhesive;
electrically coupling the at least two of the plurality of inner circuit units and the at least one outer substrate;
etching the at least one outer substrate to form an outer circuit board;
forming a second covering layer and a second protection layer on an outer surface of the outer circuit board;
forming at least one through-hole on the outer circuit board to expose the at least one solder portion; and
vertically cutting the outer circuit board to form the plurality of multilayer circuit boards, at least one side of each of the at least two of the plurality of inner circuit units does not extend to edges of the multilayer circuit board.