US Patent No. 10,660,217

METHODS OF FAST FABRICATION OF SINGLE AND MULTILAYER CIRCUIT WITH HIGHLY CONDUCTIVE INTERCONNECTIONS WITHOUT DRILLING


Patent No. 10,660,217
Issue Date May 19, 2020
Title Methods Of Fast Fabrication Of Single And Multilayer Circuit With Highly Conductive Interconnections Without Drilling
Inventorship Jun Yang, London (CA)
Tengyuan Zhang, London (CA)
Qiuquan Guo, London (CA)
Assignee Jun Yang, London, ON (CA)

Claim of US Patent No. 10,660,217

1. A method of fabricating metal-fiber conductive structures on a porous substrate, the method comprising the steps of:(i) applying a coating compound comprising poly (4-vinylpyridine) (P4VP), Polyvinylpyrrolidone (PVP) and SU-8 dissolved in an organic alcohol solution to one or more surface of the porous substrate;
(ii) curing the porous substrate at a temperature of at least 130° C. such that the porous substrate is coated with a layer of said coating compound;
(iii) printing a jet of a transition metal salt catalyst solution onto one or more printing sides of the porous substrate to deposit a transition metal salt catalyst onto the one or more printing sides;
(iv) submerging the substrate in an electroless metal deposition solution to deposit the metal on the porous substrate, wherein the deposited metal induces the formation of one or more three-dimensional metal-fiber conductive structures within the porous substrate.