US Patent No. 10,660,214

METHODS FOR CONNECTING INTER-LAYER CONDUCTORS AND COMPONENTS IN 3D STRUCTURES


Patent No. 10,660,214
Issue Date May 19, 2020
Title Methods For Connecting Inter-layer Conductors And Components In 3d Structures
Inventorship Ryan B. Wicker, El Paso, TX (US)
Francisco Medina, El Paso, TX (US)
Eric MacDonald, El Paso, TX (US)
Danny W. Muse, El Paso, TX (US)
David Espalin, El Paso, TX (US)
Assignee Board of Regents, The University of Texas System, Austin, TX (US)

Claim of US Patent No. 10,660,214

1. A method for connecting inter-layer conductors and components in an additively-manufactured structure, said method comprising:additively manufacturing a substrate material in a layer-by-layer fashion via fused deposition modeling;
applying energy to a filament to generate heat in the filament; and
embedding a portion of the filament within a layer of substrate material, wherein the heat from the energy applied to the filament places a portion of the substrate material in a flowable state that is displaced laterally by the filament so as not to substantially protrude above a top surface of said layer.