US Patent No. 10,660,213

ADHESIVE-ATTACHED COPPER FOIL, COPPER-CLAD LAMINATE, AND WIRING SUBSTRATE


Patent No. 10,660,213
Issue Date May 19, 2020
Title Adhesive-attached Copper Foil, Copper-clad Laminate, And Wiring Substrate
Inventorship Kazumichi Uchida, Yokohama (JP)
Assignee Kyocera Corporation, Kyoto (JP)

Claim of US Patent No. 10,660,213

9. A copper-clad laminate comprising:a copper foil having a roughened surface on one surface of the copper foil, the roughened surface having a silane coupling agent layer surface-treated by methacrylic silane, acrylic silane, or isocyanurate silane;
an adhesive layer formed on the roughened surface and made of a resin composition containing, as a main component thereof, modified polyphenylene ether resulting from modification of a hydroxyl group present at the end of the main chain with an ethylenically unsaturated compound; and
a prepreg laminated on the adhesive layer and made by impregnating a glass cloth with a resin composition containing, as a main component thereof, modified polyphenylene ether resulting from modification of a hydroxyl group present at the end of the main chain with an ethylenically unsaturated compound.