1. A method of constructing a device substrate, the method comprising:affixing a capacitor sheet adjacent to a core material configured to form the device substrate, the capacitor sheet covering a surface of the core material;
selecting a pass through-hole on the affixed capacitor sheet and the core material configured to form the device substrate;
patterning first openings through the capacitor sheet and the core material, the first openings being larger than the pass through-hole;
filling the first openings with an electrically inert material; and
patterning second openings parallel to the first openings through the electrically inert material, the second openings being at least as large as the pass through-hole and having sidewalls enclosed within the electrically inert material.