US Patent No. 10,660,209

THIN FILM CAPACITORS FOR CORE AND ADJACENT BUILD UP LAYERS


Patent No. 10,660,209
Issue Date May 19, 2020
Title Thin Film Capacitors For Core And Adjacent Build Up Layers
Inventorship Charles L. Arvin, Poughkeepsie, NY (US)
Brian W. Quinlan, Poughkeepsie, NY (US)
Charles L. Reynolds, Red Hook, NY (US)
Jean Audet, Granby (CA)
Francesco Preda, New Braunfels, TX (US)
Assignee International Business Machines Corporation, Armonk, NY (US)

Claim of US Patent No. 10,660,209

1. A method of constructing a device substrate, the method comprising:affixing a capacitor sheet adjacent to a core material configured to form the device substrate, the capacitor sheet covering a surface of the core material;
selecting a pass through-hole on the affixed capacitor sheet and the core material configured to form the device substrate;
patterning first openings through the capacitor sheet and the core material, the first openings being larger than the pass through-hole;
filling the first openings with an electrically inert material; and
patterning second openings parallel to the first openings through the electrically inert material, the second openings being at least as large as the pass through-hole and having sidewalls enclosed within the electrically inert material.