US Patent No. 10,660,207

CIRCUIT MODULE AND METHOD FOR MANUFACTURING THE SAME


Patent No. 10,660,207
Issue Date May 19, 2020
Title Circuit Module And Method For Manufacturing The Same
Inventorship Takafumi Kusuyama, Kyoto (JP)
Assignee MURATA MANUFACTURING CO., LTD., Kyoto (JP)

Claim of US Patent No. 10,660,207

1. A circuit module comprising:a substrate on one main surface of which a first electrode and a second electrode are provided;
a first electronic component; and
a first resin layer,
wherein the first resin layer is provided on the one main surface of the substrate,
the first electronic component is connected to the first electrode, and arranged in the first resin layer such that a surface of the first electronic component positioned on an opposite side from a surface connected to the first electrode is at least partially exposed,
the second electrode is arranged in the first resin layer such that one end of the second electrode is positioned in an outer side portion relative to an outer surface of the first resin layer,
the first electrode includes
a first electrode base body, and
a first plating film at least partially covering an outer surface of the first electrode base body,
the second electrode includes
a second electrode base body,
a metal column, whose one end is directly connected to the second electrode base body and another end is positioned in an inner side portion relative to the outer surface of the first resin layer, the metal column comprising sintered metal powder,
a second plating film with a cylindrical shape, at least partially covering a side surface of a connection body of the second electrode base body and the metal column, and having one end flush with the other end of the metal column, and
a covering portion whose one main surface is connected to the other end of the metal column and the one end of the second plating film and another main surface is positioned in the outer side portion relative to the outer surface of the first resin layer.