US Patent No. 10,660,202

CARRIER STRUCTURE AND MANUFACTURING METHOD THEREOF


Patent No. 10,660,202
Issue Date May 19, 2020
Title Carrier Structure And Manufacturing Method Thereof
Inventorship Wen-Liang Yeh, Hsinchu County (TW)
Chun-Hsien Chien, New Taipei (TW)
Chien-Chou Chen, Hsinchu County (TW)
Cheng-Hui Wu, New Taipei (TW)
Assignee Unimicron Technology Corp., Taoyuan (TW)

Claim of US Patent No. 10,660,202

1. A carrier structure, comprising:a glass substrate, having a first surface, a second surface opposite to the first surface, and at least one through hole penetrating through the glass substrate;
a buffer layer, disposed on the first surface and the second surface of the glass substrate;
an inner circuit layer, disposed on the buffer layer and in the through hole of the glass substrate, wherein the inner circuit layer exposes a part of the buffer layer, and a thickness of the buffer layer is less than a thickness of the inner circuit layer;
a first dielectric layer and a second dielectric layer, disposed on the glass substrate and filling up the through hole, wherein the first dielectric layer covers the first surface and a part of the inner circuit layer, and the second dielectric layer covers the second surface and a part of the inner circuit layer;
at least one first conductive via, penetrating through the first dielectric layer;
a first circuit layer, disposed on the first dielectric layer, and electrically connected to the inner circuit layer through the first conductive via;
at least one second conductive via, penetrating through the second dielectric layer; and
a second circuit layer, disposed on the second dielectric layer, and electrically connected to the inner circuit layer through the second conductive via.