US Patent No. 10,660,201

SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS


Patent No. 10,660,201
Issue Date May 19, 2020
Title Sensor Interposer Employing Castellated Through-vias
Inventorship Sean Frick, San Francisco, CA (US)
Louis Jung, Foster City, CA (US)
David Lari, San Francisco, CA (US)
Assignee DexCom, Inc., San Diego, CA (US)

Claim of US Patent No. 10,660,201

1. A wearable biosensor comprising:a sensor interposer comprising:
a planar substrate;
a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via formed in the planar substrate;
a second electrical contact formed on the planar substrate and electrically coupled to a second castellated through-via formed in the planar substrate, the second castellated through-via electrically isolated from the first castellated through-via; and
a guard trace formed on the planar substrate, the guard trace electrically coupled between a third through-via and a fourth through-via, the third and further through-vias formed on the planar substrate, the guard trace isolating the first and second electrical contacts;
a sensor wire physically coupled to the planar substrate, the sensor wire comprising at least two electrodes, a first electrode of the at least two electrodes electrically coupled to the first electrical contact, and a second electrode of the at least two electrodes electrically coupled to the second electrical contact; and
a sensor chemical disposed on a distal end of the sensor wire;
a printed circuit board (“PCB”) having a plurality of electrical contacts defined on a first surface of the PCB; and
wherein the sensor interposer is physically coupled to the first surface of the PCB, and wherein the first, second, third, and fourth castellated through-vias are electrically and physically coupled to respective first, second, third, and fourth electrical contacts of the plurality of electrical contacts defined on the first surface of the PCB.