US Patent No. 10,656,074

BONDLINE SENSORS


Patent No. 10,656,074
Issue Date May 19, 2020
Title Bondline Sensors
Inventorship Morteza Safai, Newcastle, WA (US)
Kimberly D. Meredith, Seattle, WA (US)
Assignee The Boeing Company, Chicago, IL (US)

Claim of US Patent No. 10,656,074

1. A method comprising:positioning a plurality of graphene sensors in a bondline of a composite structure, wherein the plurality of graphene sensors is formed of graphene doped with a noble gas;
curing the composite structure; and
determining a strength of the bondline of the composite structure using measurements from the plurality of graphene sensors, wherein the measurements are taken during the curing of the composite structure.