US Patent No. 10,624,208

LANDING PATTERN FOR BALL GRID ARRAY


Patent No. 10,624,208
Issue Date April 14, 2020
Title Landing Pattern For Ball Grid Array
Inventorship Zev Gross, Santa Clara, CA (US)
Assignee Arista Networks, Inc., Santa Clara, CA (US)

Claim of US Patent No. 10,624,208

1. A printed circuit board for a surface mount device (SMD), comprising:a printed circuit board;
adjacent, opposed first and second lands on a face of the printed circuit board, the first land comprising a first solder pad contacting or merged with a first annular pad of a first via, the second land comprising a second solder pad contacting or merged with a second annular pad of a second via, arranged for solder mounting a surface mount device to the first and second solder pads; anda solder mask on the face of the printed circuit board and having a first aperture exposing the first solder pad and a second aperture exposing the second solder pad, the first aperture touching the first annular pad, the second aperture touching the second annular pad and the solder mask not exposing the first annular pad and the second annular pad.