US Patent No. 10,616,993

HEATSINK BACKING PLATE


Patent No. 10,616,993
Issue Date April 07, 2020
Title Heatsink Backing Plate
Inventorship Matthew Gawlowski, Santa Clara, CA (US)
Richard Hibbs, Santa Clara, CA (US)
Ernie Thurlow, Santa Clara, CA (US)
Tiong Khai Song, Santa Clara, CA (US)
Robert Wilcox, Santa Clara, CA (US)
Assignee Arista Networks, Inc., Santa Clara, CA (US)

Claim of US Patent No. 10,616,993

1. An apparatus comprising:a backing plate, to attach with at least one fastener to a first heatsink with the first heatsink on a first face of a printed circuit board and in thermal contact with a surface of a first component mounted to the first face of the printed circuit board, and the backing plate on a second, opposed face of the printed circuit board, and the backing plate being in thermal contact with the second face of the printed circuit board, and the backing plate including a plurality of fins, the backing plate acting as a second heatsink for the first component and removing heat from the first component through a solid portion of the printed circuit board;
a plurality of insulated touch points arranged to offset a first face of the backing plate from the second face of the printed circuit board; and
at least one second component mounted to the second face of the printed circuit board and in contact with the first face of the backing plate, and the plurality of fins removing heat from the at least one second component.