US Patent No. 10,602,650

COMPONENT MOUNTING APPARATUS AND COMPONENT MOUNTING SYSTEM


Patent No. 10,602,650
Issue Date March 24, 2020
Title Component Mounting Apparatus And Component Mounting System
Inventorship Shigeto Oyama, Kariya (JP)
Satoshi Yoshioka, Nagoya (JP)
Hirotaka Hirayama, Toyohashi (JP)
Satoshi Ushii, Nagoya (JP)
Assignee FUJI CORPORATION, Chiryu-shi (JP)

Claim of US Patent No. 10,602,650

1. A component mounting apparatus comprising:mounting device for mounting components on a board; and
inspection device configured to determine a mounted state of the component mounted on the board, wherein
the components include a plurality of check unnecessary components that do not require checking of a mounted state of mounted components before being mounted and a plurality of check necessary components that requires checking of a mounted state of the mounted components before being mounted,
each of the check unnecessary components are mounted prior to mounting the check necessary components,
the mounting device is configured to mount a first check necessary component of the plurality of check necessary components on the board after the inspection device determines that the mounted state of the mounted components are normal, and
wherein the mounting device is configured to mount a second check necessary component on the board after checking the mounted states of the mounted components included the first mounted check necessary component are normal based on the inspection result.