US Patent No. 10,602,639


Patent No. 10,602,639
Issue Date March 24, 2020
Title Extension Portion Of Heatsink Above A Processing Component
Inventorship Kai Po Chang, Taipei (CN)
Guo Sheng Mo, Taipei (CN)
Chi Wei Cheng, Taipei (CN)
Ting Shih Chang, Taipei (CN)
Assignee Hewlett Packard Enterprise Development LP, Houston, TX (US)

Claim of US Patent No. 10,602,639

1. A cooling system within a server including processing components, the cooling system comprising:a first heatsink positioned above a processing component within the server; and
a second heatsink including:
a first portion extending above the first heat sink and the first processing component with space in between the first heatsink and the first portion, the first portion to:
receive cool air such that the first portion extending above the processing component and the first heatsink prevents heated air produced by the processing component to combine with the cool air; and
a second portion coupled to the first portion to:
receive the cool air from the first portion; and
transfer the cool air to a different processing component within the server located in a posterior position to the processing component.