US Patent No. 10,602,621

METHOD OF MANUFACTURING CIRCUIT BOARD


Patent No. 10,602,621
Issue Date March 24, 2020
Title Method Of Manufacturing Circuit Board
Inventorship Hsin-Chi Hu, Pingtung County (TW)
Assignee UNIMICRON TECHNOLOGY CORP., Taoyuan (TW)

Claim of US Patent No. 10,602,621

1. A circuit board, comprising:a resin layer, the resin layer comprising a first surface and a second surface, the resin layer comprising a plurality of vias through the resin layer, wherein an aperture size of each of the vias adjacent to the first surface is smaller than an aperture size of each of the vias adjacent to the second surface;
a first metal layer disposed in each of the vias, wherein the first metal layer protrudes from the first surface of the resin layer, and a void exists between the first metal layer and the resin layer;
a second metal layer disposed in each of the vias, wherein the first metal layer is disposed at one side of the second metal layer; and
a patterned metal layer disposed in each of the vias and at another side of the second metal layer opposite to the side, wherein the patterned metal layer covers a portion of the second surface of the resin layer.