US Patent No. 10,602,620

LAMINATE FOR PRINTED WIRING BOARD, METHOD OF MANUFACTURING PRINTED WIRING BOARD, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE


Patent No. 10,602,620
Issue Date March 24, 2020
Title Laminate For Printed Wiring Board, Method Of Manufacturing Printed Wiring Board, And Method Of Manufacturing Electronic Device
Inventorship Atsushi Miki, Ibaraki (JP)
Kazuki Kanmuri, Ibaraki (JP)
Assignee

Claim of US Patent No. 10,602,620

1. A laminate for a printed circuit board,wherein the laminate is used in a printed circuit board manufacturing method that includes a step of forming a circuit by any one of a semi-additive method, a partly additive method, a modified semi-additive method, and an embedding method, and
wherein the laminate includes an insulating resin substrate, a metal layer 1 and a metal layer 2 in this order, and when a cross section parallel to a thickness direction of the laminate is processed by means of ion milling and the cross section of the metal layer 1 and the metal layer 2 is observed with EBSD (Electron Backscatter Diffraction), in the cross section, each of the metal layer 1 and the metal layer 2 has one or a plurality of crystal grains, and an area ratio of a total area of at least one crystal grain of which a difference in angle of a <100> crystal direction from a perpendicular of the cross section is 15° or less from among the one or plurality of crystal grains of the metal layer 1 and the one or plurality of crystal grains of the metal layer 2 to a total area of the one or plurality of crystal grains in the metal layer 1 and the one or plurality of crystal grains in the metal layer 2 is 15% or higher and less than 97%.