US Patent No. 10,602,617

ELECTROLESS PLATING METHOD AND CERAMIC SUBSTRATE


Patent No. 10,602,617
Issue Date March 24, 2020
Title Electroless Plating Method And Ceramic Substrate
Inventorship Yohei Takemoto, Tokyo (JP)
Shiro Sekino, Tokyo (JP)
Yuta Kaihatsu, Tokyo (JP)
Hiromi Yamanaka, Tokyo (JP)
Assignee MITSUBISHI ELECTRIC CORPORATION, Chiyoda-Ku, Tokyo (JP)

Claim of US Patent No. 10,602,617

1. A glass ceramic substrate, comprising an insulating base material formed of glass ceramic, and a wiring pattern formed of a silver sintered body,precipitated silver being scattered in a particulate form on a glass component present on a surface of the wiring pattern formed of a silver sintered body,
a nickel plating coating being formed on the wiring pattern formed of a silver sintered body including the glass component and the silver scattered on the glass component,
a palladium plating coating being formed on the nickel plating coating,
a gold plating coating being formed on the palladium plating coating.