US Patent No. 10,602,612

VERTICAL MODULE AND PERPENDICULAR PIN ARRAY INTERCONNECT FOR STACKED CIRCUIT BOARD STRUCTURE


Patent No. 10,602,612
Issue Date March 24, 2020
Title Vertical Module And Perpendicular Pin Array Interconnect For Stacked Circuit Board Structure
Inventorship Lan H. Hoang, Los Gatos, CA (US)
Takayoshi Katahira, San Jose, CA (US)
Leilei Zhang, Sunnyvale, CA (US)
Raghunandan R. Chaware, Sunnyvale, CA (US)
Assignee Apple Inc., Cupertino, CA (US)

Claim of US Patent No. 10,602,612

1. A stacked circuit board structure comprising:a first circuit board having a first side and a second side opposite the first side, a first plurality of components placed on the second side of the first circuit board;
a second circuit board having a first side and a second side opposite the first side, wherein the first side of the second circuit board faces the second side of the first circuit board, and wherein a second plurality of components is placed on the first side of the second circuit board;
a plurality of vertical devices, each of a same height, which serve as electrical interconnections between the first circuit board and the second circuit board; and
a plurality of vertical interconnects arranged side-by-side with the plurality of vertical devices;
wherein each vertical device of the plurality of vertical devices has a same size and shape as each vertical interconnect of the plurality of vertical interconnects.